Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

About Tenstorrent:

Tenstorrent is a leading hardware and software company dedicated to advancing the field of AI and high-performance computing. Our Advanced Packaging Group pioneers next-generation solutions to push the boundaries in chip design, system integration, and reliability.

Position Overview:

Tenstorrent is seeking a highly motivated intern to join our Advanced Packaging Group. The successful candidate will conduct thermomechanical simulations using ANSYS or equivalent finite element tools, contributing to the design, analysis, and validation of advanced semiconductor packaging architectures.

Key Responsibilities:

Set up and execute thermomechanical simulations (thermal cycling, stress analysis, warpage, etc.) for advanced package designs using ANSYS or similar FEA tools.
Analyze simulation results to identify potential failure modes and recommend design improvements.
Conduct experimental characterization of mechanical structures, materials property measurement and warpage measurement.
Compare and correlate simulation predictions with experimental data to validate models and refine analysis approaches.
Collaborate closely with packaging engineers to incorporate insights from both simulation and experiments into material selection and structural design.
Document simulation and experimental procedures, models, results, and key learnings.
Participate in design reviews and present findings to the team.
Use AI to build automation tools for improving simulation workflow efficiency.

Requirements

Enrollment in a BS, MS, or PhD program in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field.
Coursework or hands-on experience in finite element analysis (FEA), preferably with ANSYS, COMSOL, Abaqus, or similar tools. Prior experience in thermomechanical simulation is a plus.
Exposure to experimental techniques for characterizing mechanical structures (such as thermal/mechanical property measurement or failure analysis) is highly desirable.
Understanding of solid mechanics concepts and materials properties.
Strong analytical, problem-solving, and time management skills.
Effective communication skills and ability to work collaboratively in a fast-paced environment.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

Mechanical Simulation Intern

Advanced Packaging Group

Tenstorrent