Package Roadmap Tool Intern

Package Innovation

Confirmed live in the last 24 hours

NXP Semiconductors

NXP Semiconductors

No salary listed

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

In Person

Package Roadmap Tool Intern – Package Innovation

Role Summary
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.

Key Responsibilities

  • Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
  • Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
  • Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
  • Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
  • Collaborate cross-functionally with platform, API, and manufacturing teams

Additional Exposure

  • Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows

Qualifications

  • Degree candidate in Computer Science (preferred), Engineering, or related field
  • Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
  • Experience with Excel, Power BI, or similar tools for visualization and tool development
  • Ability to translate technical inputs into structured, scalable frameworks
  • Self-driven with strong collaboration and communication skills


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