Internship in Investigation of Failure Mechanisms in Printed Circuit Boards

Job Description

• Higher demands on PCB technologies in the field of autonomous driving lead to higher stress on materials and design elements. During your internship you will provide us with helpful support and assist the team in investigating and evaluating damages in terms of reliability.
• The supervision and evaluation of reliability investigations and the determination of failure mechanisms (microsectioning, optical microscopy and other analytical methods like scanning electron microscopy (SEM), laser scanning microscopy (LSM) and Fourier-transform infrared spectroscopy (FTIR) are important parts of your job description.
• Additionally, you will conduct a statistical evaluation of the experimental results.

Qualifications

• Education: studies in a technical or scientific field preferably Material Science or Chemistry
• Experience and Knowledge: first experiences in experimental design, realization and evaluation of experiments; knowledge in sectioning, optical microscopy, SEM, laser scanning microscopy and FTIR
• Personality and Working Practice: you excel at working responsibly and independently, setting clear goals, and maintaining structure while effectively collaborating and communicating with your team
• Languages: very good in German or English